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AssigneeNEC Corporation
InventorsJunichi Sasaki, Ichiro Hatakeyama, Kazunori Miyoshi, Hikaru Kouta, Kaichiro Nakano, Mikio Oda, Hisaya Takahashi, Mitsuru Kurihara
Estimating the term…
An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.
A structure for mounting an LSI package onto a photoelectric wiring board, the structure comprising:
A method for fabricating a structure including a photoelectric wiring board having an optical transmission line, an LSI chip electrically connected to the photoelectric wiring board, and an optical interface for accommodating an optical element optically connected to the optical transmission line, the optical interface being electrically connected to the LSI chip, the method comprising:
An optical interface comprising:
A photoelectric wiring board comprising:
An optical interface component including a photoelectric wiring board having an optical transmission line, and an optical interface accommodating an optical element, the optical transmission line being coupled to the optical element optically,
Dependencies are inferred from the claim text.