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US 2006/0077644 A1Published application
Folded substrate with interposer package for integrated circuit devices
AssigneeIntel Corporation
InventorsRobert Nickerson, Ronald Spreitzer, John Conner, Brian Taggart
Life of this patent
Estimating the term…
Abstract
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected using an interposer and a substrate folded around the interposer. Other embodiments are described and claimed.
Claims30
A method, comprising:
- folding a foldable area of a substrate having a first plurality of interconnects disposed in a first interconnect area of said substrate and having a second plurality of interconnects disposed in a second interconnect area of said substrate wherein said substrate has a plurality of conductors passing through said foldable area and interconnecting said first interconnect area and said second interconnect area;
- connecting substrate interconnects of said first substrate interconnect area to interposer interconnects on a first side of an interposer having a core and a plurality of said interposer interconnects disposed within said interposer core;
- and
- connecting interconnects of said second substrate interconnect area to said interposer interconnects on a second side of said interposer.
1 more element
A device, comprising:
- an interposer having a core and a plurality of said interposer interconnects disposed within said interposer core;
- and
- a substrate having a folded foldable area having a plurality of conductors passing through said foldable area;
- said substrate further having a first interconnect area having a first plurality of interconnects at least some of which are connected to said interposer interconnects on a first side of said interposer, and a second interconnect area having a second plurality of interconnects at least some of which are connected to said interposer interconnects on a second side of said interposer.
1 more element
A portable system, comprising:
- a circuit board
- an input electrically coupled to said circuit board;
- an output electrically coupled to said circuit board;
- and
- an interposer having a core and a plurality of said interposer interconnects disposed within said interposer core;
- and
- an electronic device disposed on said circuit board and occupying less than 30 mm2 of said circuit board, said device having a substrate having a folded foldable area having a plurality of conductors passing through said foldable area;
- said substrate further having a first interconnect area having a first plurality of interconnects at least some of which are connected to said interposer interconnects on a first side of said interposer, and a second interconnect area having a second plurality of interconnects at least some of which are connected to said interposer interconnects on a second side of said interposer, said device further having a first element selected from a group consisting of an integrated circuit package, an integrated circuit die, a substrate for an integrated circuit, wherein said first element has conductive contacts connected to at least some of said interconnects of said first substrate interconnect area, and a second element selected from a group consisting of an integrated circuit package, an integrated circuit die, a substrate for an integrated circuit, wherein said second element has conductive contacts connected to at least some of said interconnects of said second substrate interconnect area.
5 more elements
Dependencies are inferred from the claim text.