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US 2006/0077227 A1Published application
Bonding structure, actuator device and liquid-jet head
AssigneeSeiko Epson Corporation
InventorsHiroshige Owaki, Yoshinao Miyata
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Abstract
A bonding structure comprising bonding wires having a diameter A, bonding pads to which the bonding wires are connected, and bonding portions which, as sites of connection, are arranged on a straight line, and wherein the pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for the bonding procedure.
Claims8
A bonding structure comprising:
- bonding wires having a diameter A;
- bonding pads to which the bonding wires are connected;
- and
- bonding portions, as sites of connection, arranged on a straight line, and
- wherein a pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for a bonding procedure.
2 more elements
A bonding structure comprising:
- bonding wires having a diameter A;
- bonding pads to which the bonding wires are connected;
- and
- bonding portions, as sites of connection, arranged on a straight line, and
- wherein the bonding wires are arranged in an inclined manner at an angle θ with respect to a direction perpendicular to a direction of arrangement of the bonding portions, and a pitch of the bonding portions is set at (XA+σ)/cos θ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for a bonding procedure.
2 more elements
A bonding structure comprising:
- bonding wires having a diameter A;
- bonding pads to which the bonding wires are connected;
- and
- bonding portions, as sites of connection, arranged on a straight line, and
- wherein a pitch P of the bonding portions is set at XA+σ or more where 1.80≦X≦2.1, A is as defined above, and σ denotes a variation for a bonding procedure, and
- wherein the bonding wires are arranged in an inclined manner at an angle θ with respect to a direction perpendicular to a direction of arrangement of the bonding portions, and the angle θ is rendered smaller than cos−{(XA+σ)/pitch P} where 1.80≦X≦2.1, A is as defined above, and σ denotes the variation for the bonding procedure.
3 more elements
Dependencies are inferred from the claim text.