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AssigneeLexmark International, Inc.
InventorsKarthik Vaideeswaran, Andrew McNees, John Krawczyk, James Mrvos, Cory Hammond, Mark Doerre, Jason Vanderpool, Girish Patil, Christopher Money, Gary Williams, Richard Warner
Estimating the term…
A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.
1-24. (canceled)
A semiconductor substrate for an ink jet printhead, the substrate comprising a first surface, a second surface opposite the first surface, and one or more ink feed ports therein extending from the first surface to the second surface, the one or more ink feed ports are formed at least in part by a reactive ion etching process and having side wall surfaces having a water contact angle of less than about ninety degrees for improved ink flow through the one or more ink feed ports.
A silicon substrate for a micro-fluid ejection device, the substrate comprising a first surface, a second surface opposite the first surface, and one or more fluid feed ports therein extending from the first surface to the second surface, the one or more fluid feed ports are formed at least in part by a reactive ion etching process and having side wall surfaces having a water contact angle surface energy providing improved fluid flow through the one or more fluid feed ports.
A substrate for a micro-fluid ejection device, the substrate comprising a first surface, a second surface opposite the first surface, and one oar more fluid feed ports therein extending from the first surface to the second surface, the one or more fluid feed ports are formed at least in part by a reactive ion etching process and having side wall surfaces having improved wettability for improved fluid flow through the one or more fluid feed ports.
Dependencies are inferred from the claim text.