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US 2006/0077020 A1Published application
Circuits and manufacturing configurations of compact band-pass filter
AssigneeCyntec Co., Ltd.
InventorsChung-Hsiung Wang, Keng-Hong Wang
Life of this patent
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Abstract
A filter circuit that includes a thin film layer supported on a substrate serving as a medium layer for a capacitor formed between a top electrode layer and a bottom electrode layer formed above and below the thin film layer. The top electrode layer is patterned into microstrips for functioning as an inductor for the filter circuit.
Claims43
A filter circuit comprising:
- a thin film layer supported on a substrate serving as a medium layer for a capacitor between a top electrode layer and a bottom electrode layer formed above and below said thin film layer wherein said top electrode layer further comprising a microstrip for functioning as an inductor for said filter circuit.
A bandpass filter (BPF) comprising:
- a thin film dielectric layer supported on an aluminum oxide substrate wherein said thin film dielectric layer serving as a medium layer for a capacitor between a top metallic electrode layer and a bottom metallic electrode layer formed above and below said thin film dielectric layer wherein said top electrode layer further comprising a microstrip for functioning as an inductor for said BPF;
- said top electrode layer further comprising at least two microstrips each functioning as an inductor and coupled as a capacitor;
- an adhesion layer disposed between said thin film layer and said bottom electrode layer;
- a glass layer printed onto said substrate disposed below said bottom electrode layer;
- a ground layer disposed on a bottom surface of said substrate;
- a protection layer overlying said top electrode for protecting said filter circuit;
- a side-wrapping-around ground-connection layer for wrapping around a side surface of said substrate for connecting a circuit element on a top surface to said ground layer disposed on said bottom surface of said substrate;
- and
- a side-wrapping-around signal-connection layer for wrapping around a side surface of said substrate to function as a side terminal for connecting to a signal input or output terminal to said filter circuit.
6 more elements
A bandpass filter comprising:
- a top electrode layer and a bottom electrode layer disposed above and below a thin dielectric layer supported on a substrate wherein said top and bottom electrode layer having microstrips to function as inductors and capacitors;
- wherein
- said bandpass filter further having an attenuated transmission frequency outside of a bandpass frequency rang of said bandpass filter.
A method for manufacturing a filter circuit comprising:
- forming a thin film layer on a substrate to function as a medium layer and forming a capacitor by forming a top electrode layer and a bottom electrode layer above and below said thin film layer;
- and
- patterning said top electrode layer into a microstrip for functioning as an inductor for said filter circuit.
Dependencies are inferred from the claim text.