Membrane with bumps, method of manufacturing the same, and method of testing electrical circuit
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorIzuru Matsuda
Life of this patent
Estimating the term…
Abstract
Provided is membrane with bumps whose variations in shape are minimized to the least and which are capable of supporting a micro electrical circuit. A membrane with bumps includes: a plurality of bumps, each of which is made up of a probe and an electrode, the probe having a diameter which becomes smaller from one end toward the other end of the probe, and the electrode having a diameter which is larger than the diameter of the one end of the probe; and an insulating base where the bumps are positioned at predetermined locations so that the bumps are insulated from each other, wherein the probe is positioned, penetrating the insulating base in a thickness direction, and a metal film is placed in between the electrode and the insulating base.
Claims17
A membrane with bumps, comprising:
- a plurality of bumps, each of which is made up of a probe and an electrode, said probe having a diameter which becomes smaller from one end toward the other end of said probe, and said electrode having a diameter which is larger than the diameter of the one end of said probe;
- and
- an insulating base where said bumps are positioned at predetermined locations so that said bumps are insulated from each other,
- wherein said probe is positioned, penetrating said insulating base in a thickness direction, and a metal film is placed in between said electrode and said insulating base.
A method of manufacturing a membrane with bumps, said method comprising:
- preparing a lamellar body in which a metal film layer, an insulating body layer, a mold base layer, and a stop layer are laminated in order of mention;
- forming micro holes in the lamellar body, each of the micro holes having a diameter which is smaller from the metal film layer toward the mold base layer;
- forming a resin pattern layer on a surface of the metal film layer that does not face the insulating base layer, the resin pattern layer having apertures, each of which is continuous with the micro hole and whose diameter is larger than the diameter, of the micro hole, at the surface of the metal film layer that does not face the insulating base layer;
- forming bumps, each of which has a probe and an electrode, by filling the micro holes and the apertures with a conductive material, the probe having a diameter which becomes smaller from one end toward the other end of the probe, and the electrode having a diameter which is larger than the diameter of the one end of the probe;
- removing a part of the metal film layer so that the bumps become insulated from each other;
- removing the mold base layer from the insulating base layer;
- and
- removing the resin pattern layer.
Dependencies are inferred from the claim text.