Multi-chip integrated circuit module for high-frequency operation

A multi-chip electronic memory module for operation at a clock frequency of at least 500 MHz, said module comprising:

• a lead frame including a paddle,
• a multiplicity of memory chips,
• a multiplicity of spacers interleaved with said chips to form a vertical stack,
• said stack being mounted on said paddle,
• a multiplicity of first electronic terminals, each of said chips having at least one of said first terminals, at least a first subset of said first terminals being disposed at different heights relative to said paddle,
• a multiplicity of second electronic terminals disposed on said lead frame, and
• a multiplicity of wirebonds, each of said wirebonds being connected between a pair of said first subset of first terminals and at least a second subset of second terminals, characterized in that
• said wirebonds all have substantially the same cross-section and the same length.

An electronic circuit for operation at a particular frequency comprising

• a multiplicity of first electrical terminals, at least a first subset of said first terminals being located at different distances relative to a common reference plane,
• a multiplicity of second electrical terminals, and
• a multiplicity of electrical conductors connected between said first subset and at least a second subset of said second terminals, characterized in that
• said first and second subsets are configured so that said conductors all have substantially the same inductive impedance at said frequency.