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US 2006/0076649 A1Published application
Substrate for stressed systems and method of making same
AssigneeS.O.I. Tec Silicon on Insulator Technologies
InventorsFabrice Letertre, Bruno Ghyselen, Olivier Rayssac
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Abstract
A stress absorbing microstructure assembly including a support substrate having an accommodation layer that has plurality of motifs engraved or etched in a surface, a buffer layer and a nucleation layer. The stress absorbing microstructure assembly may also include an insulating layer between the buffer layer and the nucleation layer. This assembly can receive thick epitaxial layers thereon with concern of causing cracking of such layers.
Claims20
A stress absorbing microstructure assembly comprising:
- a support substrate;
- a transferred nucleation layer bonded with at the support substrate, the nucleation layer being transferred by a layer transfer process from a different substrate;
- and
- a mechanical stress absorbing system associated with the support substrate.
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A stress absorbing microstructure assembly comprising:
- a support substrate;
- a nucleation layer deposited on the support substrate;
- and
- a mechanical stress absorbing system associated with the substrate, which comprises an accommodation layer that has an elasticity that is parallel to the surface of the support substrate, wherein the elasticity of the accommodation layer compensates for thermoplastic stress applied to the substrate, wherein the accommodation layer is defined by a plurality of motifs formed in a surface of the substrate and at least one of the motifs on the surface of the substrate is obturated with species to provide a smooth bonding surface.
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Dependencies are inferred from the claim text.