System and method for protecting microelectromechanical systems array using structurally reinforced back-plate
AssigneeIdc, LLC
InventorsBrian Gally, Lauren Palmateer, William Cummings
Life of this patent
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Abstract
Disclosed is an electronic device utilizing interferometric modulation and a package of the device. The packaged device includes a substrate, an interferometric modulation display array formed on the substrate, and a back-plate. The back-plate is placed over the display array with a gap between the back-plate and the display array. The device further includes reinforcing structures which are integrated with the back-plate. The reinforcing structures add stiffness to the back-plate. The back-plate may have a thickness varying along an edge thereof.
Claims36
An electronic device, comprising:
- a substrate;
- an array of microelectromechanical devices formed on the substrate, the array having a back-surface facing away from the substrate;
- a back-plate placed over the array and having an interior surface and an exterior surface, the interior surface facing the back-surface of the array with a gap therebetween, the exterior surface facing away from the substrate;
- and
- one or more reinforcing structures integrated with the back-plate.
An electronic device, comprising:
- a substrate;
- a microelectromechanical array formed on the substrate, the array having a back-surface facing away from the substrate;
- a back-plate placed over the array and having an interior surface, which faces the back-surface of the array with a gap therebetween, wherein the back-plate has a thickness varying along an edge thereof.
An electronic device, comprising:
- a substrate;
- an array of interferometric modulators formed on the substrate, the array having a back-surface facing away from the substrate;
- a back-plate placed over the array and having an interior surface facing the back-surface of the array with a gap between the interior surface and the back-surface of the array;
- and
- means for preventing the interior surface from directly contacting the back-surface of the array.
A method of making an electronic device, comprising:
- providing an intermediate device comprising a substrate and an array of microelectromechanical devices formed on the substrate;
- and
- forming a back-plate over the array of the intermediate device with a gap between the back-plate and the array, the back-plate having an interior surface and an exterior surface, the interior surface facing the array, the back-plate being integrated with one or more reinforcing structures formed on at least one of the interior surface and the exterior surface.
An electronic device produced by a method comprising:
- providing an intermediate device comprising a substrate and an array of microelectromechanical devices formed on the substrate;
- and
- forming a back-plate over the array of the intermediate device with a gap between the back-plate and the array, the back-plate having an interior surface and an exterior surface, the interior surface facing the array, the back-plate being integrated with one or more reinforcing structures formed on at least one of the interior surface and the exterior surface.
Dependencies are inferred from the claim text.