Structure of chip carrier for semiconductor optical device, optical module, and optical transmitter and receiver
AssigneeOpnext Japan, Inc.
InventorsNoriko Sasada, Kazuhiko Naoe, Masataka Shirai, Hideo Arimoto, Satoshi Tada
Life of this patent
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Abstract
A chip carrier includes a metal-coated portion formed on a front surface of a substrate and to be mounted a device, and a rear surface of the substrate being coated with a metal, in which a metal-coated portion is formed on a side surface of the substrate and the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate, thereby maintaining frequency characteristics of the optical semiconductor device.
Claims18
A chip carrier including a dielectric or semiconductor substrate, one surface of which includes a metal-coated portion and an opposite surface of which includes a high frequency transmission line and a metal-coated portion to mount a device, wherein
- said metal-coated portion of said one surface is connected with said metal-coated portion of said opposite surface through a metal-coated portion formed on a side surface of said substrate.
A chip carrier including a dielectric or semiconductor substrate having a metal-coated portion formed on a front surface of the substrate to mount a device and a high frequency transmission line arranged on a front surface, and a metal-coated portion formed on a rear surface of the substrate,
- wherein a metal-coated portion is formed on a side surface of the substrate, and
- wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate.
A chip carrier including a dielectric or semiconductor substrate having a metal-coated portion formed on a front surface of a substrate to mount an optical semiconductor device and a high frequency transmission line arranged on a front surface, and a metal-coated portion on a rear surface of the substrate,
- wherein a metal-coated portion is formed on a side surface of the substrate, and
- wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate.
A chip carrier including a dielectric or semiconductor substrate having a metal-coated portion formed on a front surface of the substrate to mount a device and a high frequency transmission line arranged on a front surface, and metal-coated portion formed on a rear surface of the substrate, and
- an inductance reducer structure in a form of a metal-coated portion formed on a side surface of the substrate, and
- wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate.
A chip carrier including a dielectric or semiconductor substrate having a metal-coated portion formed on a front surface of a substrate to mount an optical semiconductor device and a high frequency transmission line arranged on a front surface, and a metal-coated portion on a rear surface of the substrate, and
- an inductance reducer structure in a form of a metal-coated portion formed on a side surface of the substrate, and
- wherein the metal-coated portion on the front surface of substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate.
An optical module comprising:
- a chip carrier including a dielectric or semiconductor substrate having a metal-coated portion formed on a front surface of a substrate to mount an optical semiconductor device and a high frequency transmission line arranged on a front surface, and a metal-coated portion on a rear surface of the substrate, wherein a metal-coated portion is formed on a side surface of the substrate, and wherein the metal-coated portion on the front surface of the substrate is connected with the metal-coated portion on the rear surface by the metal-coated portion formed on the side surface of the substrate;
- and
- the optical semiconductor device is mounted to the metal-coated portion on the front surface of the substrate.
Dependencies are inferred from the claim text.