Semiconductor light-emitting element assembly
AssigneeEpistar Corporation
InventorsMin-Hsun Hsieh, Chou-Chih Yin, Chien-Yuan Wang, Jen-Shui Wang, Chia-Fen Tsai, Chia-Liang Hsu
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Abstract
A semiconductor light-emitting element assembly, comprising a composite substrate, a circuit layout carrier, a connecting structure, a recess, and a semiconductor light-emitting element, is disclosed. The connecting structure is used for bonding the composite substrate with the circuit layout carrier. The recess is formed by the circuit layout carrier and extends toward the composite substrate. The semiconductor light-emitting element is deposited in the recess and electrically connected to the circuit layout carrier.
Claims33
A semiconductor light-emitting element assembly, comprising:
- a composite substrate with a thermal expansion coefficient substantially smaller than or equal to 12×10−6/° C., and a thermal conductivity coefficient substantially greater than or equal to 150 W/mK;
- a circuit layout carrier;
- a connecting structure for bonding the composite substrate with the circuit layout carrier;
- and
- a semiconductor light-emitting element disposed on one side of the composite substrate and electrically connected to the circuit layout carrier.
Dependencies are inferred from the claim text.