SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power

An SMD-type light emitting diode with high efficiency of heat dissipation, comprising:

• a base including a post arranged and integrated at the center thereof, a slot formed on the top of the post;
• wherein at least one contact hole is disposed on the bottom of the base;
• at least one LED chip mounted in the slot of the base;
• a circuitry extension device having a central hole, at least a first pair of positive and negative contacts and at least a second pair of positive and negative contacts for connecting to an external circuit;
• the first pair of positive and negative contacts being positioned over an upper surface of the circuitry extension device for connecting with positive and negative electrodes, respectively, of the LED chip;
• the circuitry extension device being disposed on the top of the base and being connected with the base by a heat resistant glue;
• wherein the LED chin is electrically connected with the circuitry extension device by a wire, and further connected with the external circuit through an extension circuit on the upper surface of the circuitry extension device;
• and
• wherein the contact hole of the base is a blind hole with thread.

An SMD-type light emitting diode with high efficiency of heat dissipation, comprising:

• a base having a post arranged and integrated at the center thereof, a slot formed on the top of the post;
• wherein at least one contact hole is disposed on the bottom of the base;
• at least one LED chip mounted in the slot of the base;
• and
• a hollow metal leadframe encapsulated with plastic having at least a pair of positive and negative contacts, and pins extended on two sides thereof;
• the metal leadframe encapsulated with plastic being disposed on the top of the base and being connected with the base by a heat resistant glue;
• wherein the LED chip is electrically connected with the positive and negative contacts of the metal leadframe encapsulated with plastic by a wire selected from a group consisting of a gold wire and an aluminum wire, and further connected with an external circuit through the pins of the metal leadframe encapsulated with plastic.

An SMD-type light emitting diode with high efficiency of heat dissipation comprising

• a base with a post arranged and integrated on the center thereof, a slot on top of the post;
• a blind hole with thread is disposed on the bottom of the post of the base;
• at least one LED chip mounted in the slot of the base;
• a hollow metal leadframe encapsulated with plastic having at least a pair of positive and negative contacts, and pins extended on two sides thereof;
• the metal leadframe encapsulated with plastic is on top of the base and is connected with the base by heat resistant glue;
• wherein the LED chip is electrically connected with the positive and negative contacts of the metal leadframe encapsulated with plastic by gold wire or aluminum wire, and then further connected with external circuit through the pins of the metal leadframe encapsulated with plastic.