Method of modifying an etched trench
AssigneeSilverbrook Research Pty Ltd
InventorsDarrell McReynolds, Kia Silverbrook
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Abstract
A process for facilitating modification of an etched trench is provided. The process comprises: (a) providing a wafer comprising an etched trench, the trench having a photoresist plug at its base; and (b) removing a portion of the photoresist by subjecting the wafer to a biased oxygen plasma etch. The process is particularly suitable for preparing a trench for subsequent argon ion milling. Printhead integrated circuits fabricated by a process according to the invention have improved ink channel surface profiles and/or surface properties.
Claims20
A process for facilitating modification of an etched trench, the process comprising:
- (a) providing a wafer comprising at least one etched trench, the at least one trench having a photoresist plug at its base;
- and
- (b) removing a portion of the photoresist by subjecting the wafer to a biased oxygen plasma etch.
A method of fabricating an inkjet printhead integrated circuit comprising a plurality of nozzles, ejection actuators, associated drive circuitry and ink supply channels, the method comprising the steps of:
- (i) providing a wafer having a front drop ejection side and a back ink supply side;
- (ii) etching a plurality of trenches partially into the drop ejection side of the wafer;
- (iii) filling each of the trenches with a photoresist plug;
- (iv) forming a plurality of corresponding nozzles, ejection actuators and associated drive circuitry on the drop ejection side of the wafer using lithographically masked etching techniques;
- (v) back-etching a plurality of corresponding ink supply channels from the ink supply side of the wafer to and past the photoresist plugs;
- (vi) removing a portion of each photoresist plug by subjecting the wafer to a biased oxygen plasma etch, thereby exposing angular sidewall features in the ink supply channels;
- (vii) modifying the exposed angular sidewall features;
- and
- (viii) stripping the photoresist plugs from the trenches to form nozzle inlets, thereby providing fluid connection between the ink supply side and the nozzles.
Dependencies are inferred from the claim text.