Process for preparing a non-conductive substrate for electroplating
OwnerHyunjung Lee, Richard Retallickinventors
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Abstract
A process for preparing a non-conductive substrate for electroplating is proposed. The proposed process comprises contacting the substrate, after des{acute over (m)}ear, with a combined neutralization/sacrificial coating solution followed by treatment with a carbon dispersion solution. The combined neutralization/sacrificial coating solution neutralizes permanganate residues from the desmear step and applies a sacrificial coating to metallic surfaces on the substrate. The sacrificial coating allows for easy and reliable removal of unwanted carbon residues from the metallic surfaces prior to electroplating.
Claims5
A process for plating objects comprised of metallic areas and non-conductive areas, said process comprising contacting the object with:
- a. alkaline desmear solution comprising permanganate ions;
- b. neutralization solution comprising (i) acid, (ii) hydrogen peroxide, and (iii) corrosion inhibitor;
- c. conditioner solution comprising a material selected from the group consisting of surfactants and water soluble polymers;
- d. aqueous dispersion of carbon particles comprising (i) a material selected from the group consisting of surfactants and water soluble polymers, and (ii) carbon particles;
- e. drying;
- f. microetchant solution;
- g. copper electroplating solution with an electrical potential applied.
Dependencies are inferred from the claim text.