Loading patent…
AssigneeCanon Kabushiki Kaisha
InventorsMikiya Umeyama, Yutaka Koizumi, Yukuo Yamaguchi, Akira Goto, Masaru Iketani, Yuichiro Akama
Estimating the term…
In a flexible wiring board for use in, for example, a liquid discharge head, wires disposed on a substrate in parallel are covered with a film material. The flexible wiring board is bendable towards one of a front surface side and a back surface side of the substrate and includes a bending line. The bending line is formed by bending the flexible wiring board along a bending direction crossing a longitudinal direction of the wires. The bending line contains the wires. Both ends of the flexible wiring board in the bending direction are located on the bending line. A distance between one of the wires located closest to one end of the flexible wiring board and the one end is larger on the bending line than in another part of the flexible wiring board. Accordingly, even if the flexible wiring board is bent at a small bend radius, peeling does not easily occur between a base film and a cover film.
A flexible wiring board in which wires disposed on a substrate in parallel are covered with a film material and which is bendable towards one of a front surface side and a back surface side of the substrate, the flexible wiring board comprising:
A liquid discharge head for discharging liquid responsive to an electrical signal from outside, the liquid discharge head comprising:
Dependencies are inferred from the claim text.