Method and apparatus for controlling temperature of a substrate
AssigneeApplied Materials, Inc.
InventorsJohn Holland, Theodoros Panagopoulos
Life of this patent
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Abstract
A pedestal assembly and method for controlling temperature of a substrate during processing is provided. In one embodiment, the pedestal assembly includes a support member that is coupled to a base by a material layer. The material layer has at least two regions having different coefficients of thermal conductivity. In another embodiment, the support member is an electrostatic chuck. In further embodiments, a pedestal assembly has channels formed between the base and support member for providing cooling gas in proximity to the material layer to further control heat transfer between the support member and the base, thereby controlling the temperature profile of a substrate disposed on the support member.
Claims40
A substrate pedestal assembly comprising:
- a substrate support member;
- a base having a first surface;
- and
- a material layer disposed between and contacting the first surface and the support member, wherein the material layer comprises a plurality of material regions, at least two of the material regions having different coefficients of thermal conductivity.
An apparatus for processing a substrate, comprising:
- a process chamber;
- a substrate pedestal assembly disposed in the chamber and comprising a base coupled to an electrostatic chuck by a material layer, the material layer comprising a at least two material regions having different coefficients of thermal conductivity;
- a first channel formed between the chuck and base;
- a source of at least one process gas coupled to the chamber;
- and
- a source of heat transfer medium fluidly coupled to the first channel.
A substrate support pedestal assembly comprising:
- a temperature controlled base;
- a support member coupled to the base;
- and
- at least a first passage laterally disposed and at least partially bounded by the support member and the base, the first passage adapted to provide a heat transfer medium between an interface of the support member and the base.
A substrate support pedestal assembly comprising:
- a support member having an upper surface adapted to support a substrate during processing;
- a temperature controlled base;
- and
- an adhesive layer coupling the support member to the base, wherein the adhesive material layer has an anisotropic coefficient of thermal conductivity.
A method for controlling the temperature profile of a substrate supported on a pedestal assembly comprising:
- providing, to substrate support pedestal assembly having a support member disposed on a base, a heat transfer medium between an interface of the support member and the base;
- and
- thermally regulating the base.
Dependencies are inferred from the claim text.