Method of cutting laminate, apparatus for manufacturing laminate, method of manufacturing laminate, and laminate
AssigneeFujitsu Limited
InventorsToshikazu Furui, Naohisa Matsushita
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Abstract
A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.
Claims14
A method of manufacturing a laminate composed of a first and a second substrate made of materials, the transmittance or absorptance with respect to a laser beam of which is different from each other, the method comprising the steps of:
- forming a groove on one of the first and the second substrates;
- putting one substrate, on which the groove is formed, upon the other substrate so that the groove can be directed to the other substrate;
- and
- irradiating a laser beam onto the first and the second substrate from the one substrate side, on which the groove is formed, along the groove, so that the laminate composed of the first and the second substrate can be cut.
A laminate comprising:
- a first substrate which does not transmit a laser beam;
- and a second substrate which transmits a laser beam, wherein the first and the second substrate are put together, and the second substrate has a groove on the side directed to the first substrate.
An apparatus of manufacturing a laminate having a mechanism of cutting a laminate composed of a first and a second substrate, wherein a groove is formed on one of the substrates, and the substrates are put together so that the groove formed on one of the substrates can be directed to the other substrate, the apparatus comprising:
- a laser beam source;
- an optical system for condensing a laser beam;
- a table on which the laminate is put;
- and
- a moving mechanism for relatively moving the laser beam source and the table, wherein the laminate is put on the table so that one substrate, on which the groove is formed, can be directed to the laser beam source, and the laminate is cut when the laser beam source is relatively moved with respect to the table and the laser beam is irradiated along the groove.
A method of manufacturing a laminate comprising:
- a step of forming a groove in one of the first and the second substrate;
- a step of laminating the first and the second substrate on each other so that the groove on one substrate can be directed to the other substrate;
- a step of moving the laser beam source relative to the laminate while laser beam is being irradiated to the laminate along the groove.
A laminate comprising:
- a first substrate which does not transmit a laser beam;
- and
- a second substrate which transmits a laser beam, wherein the first and the second substrate are joined to each other, the second substrate has a groove on the side directed to the first substrate, and cutting is conducted along the groove while the first and the second substrate are maintained in the joined state.
Dependencies are inferred from the claim text.