Film peeling apparatus and method of manufacturing wiring board

The method of manufacturing a wiring board having an insulating layer which comprises:

• applying an insulating material and carrier film to a board, the carrier film being arranged on a side of the insulating material opposite the board;
• after the application step, piercing a peripheral portion of the carrier film by use of a needle to thereby form a through hole;
• and
• after the through-hole forming step, peeling off the carrier film, starting from an air pocket formed around the through hole to leave the insulating material, which serves as the insulating layer, on the board.

An apparatus for peeling a carrier film from a board to which an insulating material and carrier film has been bonded, the carrier film being arranged on a side of the insulating material opposite the board, the apparatus comprising:

• a board support section for supporting the board;
• a hole forming jig having a tip-sharpened member for piercing a peripheral portion of the carrier film so as to form a through hole;
• jig drive means for driving the hole forming jig so as to pierce the carrier film by means of the tip-sharpened member;
• and
• a peeling mechanism for peeling off the carrier film, starting from an air pocket formed around the through hole.

A method of manufacturing a wiring board having an insulating layer, which comprises:

• applying an insulating material and carrier film to a board, the carrier film being arranged on a side of the insulating material opposite the board;
• after the application step, piercing a peripheral portion of the carrier film using a tip-sharpened member to thereby form a through hole;
• and
• after the through-hole forming step, peeling off the carrier film, starting from an air pocket formed around the through hole to leave the insulating material, which serves as the insulating layer, on the board.