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AssigneeThe Board of Trustees of the Leland Stanford Junior University
InventorsYongli Huang, Xuefeng Zhuang, Butrus Khuri-Yakub, Ching-Hsiang Cheng, Arif Ergun
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The embodiments of the present invention provide a CMUT array and method of fabricating the same. The CMUT array has CMUT elements individually or respectively addressable from a backside of a substrate on which the CMUT array is fabricated. In one embodiment, a CMUT array is formed on a front side of a very high conductivity silicon substrate. Through wafer trenches are etched into the substrate from the backside of the substrate to electrically isolate individual CMUT elements formed on the front side of the substrate. Electrodes are formed on the backside of the substrate to individually address the CMUT elements through the substrate.
A transducer array comprising a conductive substrate having a front side and a backside, a plurality of transducer elements provided on the front side of the substrate, a plurality of electrodes provided on the backside of the substrate and electrically isolated from each other, the plurality of electrodes for addressing through the substrate the respective plurality of transducer elements.
A capacitive micromachined ultrasonic transducer (CMUT), comprising:
A process for fabricating a CMUT device, comprising:
Dependencies are inferred from the claim text.