# US 2006/0071084 A1 · Process for manufacture of novel, inexpensive radio frequency identification devices > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2006/0071084 A1 - Document ID: US20060071084A1 - Status: Published application - Kind: A1 - Application number: 10/539,158 - Filed: 2001-12-14 - Published: 2006-04-06 - Earliest claimed: 2000-12-15 - Assignees: Electrox Corporation - Inventors: Robert Detig; Vernon Bremberg - Web page: https://patentgrep.com/patent/US20060071084A1 ## CPC - H01Q 1/2225: {used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal} - G06K 19/07749: {the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card} - G06K 19/0775: {arrangements for connecting the integrated circuit to the antenna} - G06K 19/07756: {the connection being non-galvanic, e.g. capacitive} - G06K 19/07775: {the antenna being on-chip} - G06K 19/07779: {the inductive antenna being a coil} - G06K 19/07783: {the coil being planar} - G06K 19/07784: {the inductive antenna consisting of a plurality of coils stacked on top of one another} - G08B 13/2417: {having a radio frequency identification chip} - G08B 13/2437: {Tag layered structure, processes for making layered tags} - H01Q 1/44: using equipment having another main function to serve additionally as an antenna {, e.g. means for giving an antenna an aesthetic aspect}(H01Q1/27 - H01Q1/34 take precedence) - H01Q 7/00: Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop - H01Q 9/27: Spiral antennas - H10D 62/117: {Shapes of semiconductor bodies} - H10W 70/699: {for flat cards, e.g. credit cards} - H10W 74/114: {by a substrate and the encapsulations} - H10W 72/07236: {Soldering or alloying} - H10W 72/073: {of die-attach connectors} - H10W 72/07331: {Connecting techniques} - H10W 72/325: {Die-attach connectors having a filler embedded in a matrix} - H10W 72/351: {Materials of die-attach connectors} - H10W 72/354: {comprising polymers} - Y10T 29/49018: with other electrical component - H01Q: ANTENNAS, i.e. RADIO AERIALS (radiators or antennas for microwave heating H05B6/72) - G06K: GRAPHICAL DATA READING (image or video recognition or understanding G06V); PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS - G08B: SIGNALLING SYSTEMS, e.g. PERSONAL CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A novel process for fabricating low cost RFID devices in which a pattern of metallic toner is printed on a substrate and the contacts on a silicon die are placed directly on contact points printed as part of the pattern of metallic toner; the whole device is then heated to both cure the metallic toner into metallic conductors and bond the silicon die to the metallic conductors. Alternatively, the silicon die can be physically attached to the substrate and the electrical pathway between the silicon die and the metallic conductors is established via a transformer coupling comprised of a coil winding on the silicon die and a pattern of coils printed as part of the metallic toner pattern. The pattern of coils can be comprised of individually printed coil loops printed on, and separated by, dielectric layers. ## Claims ### Claim 1 An RFID device comprising a substrate; an antenna means on said substrate, said antenna means being comprised of a metal toner printed in a pattern comprising at least one loop: at least one silicon chip; and a connection means for electrically connecting said antenna means and said silicon chip. ### Claim 2 (depends on 1) The RFID device of claim 1 wherein said connection means is comprised of an electrically conductive adhesive. ### Claim 3 (depends on 1) The RFID device of claim 1 wherein said connection means is comprised of: a first coil means connected to said antenna means and a second coil means connected to said silicon chip. wherein said first coil means and said second coil means are proximally located thereby facilitating electrical communication. ### Claim 4 (depends on 3) The RFID device of claim 3 wherein said first coil means is comprised of at least two loops wherein each of said at least two loops is separated by a layer of dielectric. ### Claim 5 (depends on 4) The RFID device of claim 4 wherein said first coil means has at least a first and a second loop each loop having two endpoints, wherein a first loop is located on said substrate and a second loop is located on a dielectric layer located above said first loop, wherein one endpoint of said first loop is connected to said antenna means and the second endpoint of said first loop is connected to the first endpoint of said second loop through a hole in the dielectric layer and wherein the second endpoint of said second loop is connected to said antenna means through an opening in the dielectric layer. ### Claim 6 (depends on 3) The RFID device of claim 3 wherein said first coil means is comprised of at least two loops wherein each of said at least two loops is separated by a layer of dielectric. ### Claim 7 (depends on 3) The RFID device of claim 3 wherein said second coil means is located on said silicon chip. ### Claim 8 (depends on 1) The RFID device of claim 1 wherein said antenna means is printed on said substrate. ### Claim 9 (depends on 8) The RFID device of claim 8 wherein printing is by electrostatic or inkjet printing methods. ### Claim 10 (depends on 3) The RFID device of claim 3 wherein said connection means is printed by electrostatic or inkjet printing methods. ### Claim 11 (depends on 7) The RFID device of claim 7 wherein said second coil means is printed by electrostatic or inkjet printing methods. ### Claim 12 (depends on 1) The RFID device of claim 1 further comprising a protective coating. ### Claim 13 A process for the manufacture of RFID devices consisting of the following: a. Electrostatic printing of a metal toner on a coated substrate, said printing comprising an antenna having at least one loop; b. The drying of this metal toner image; c. The mechanical placement of a silicon die on this dried, printed metal toner image; d. The heating of this assembly to a suitable temperature causing a sintering of the metal toner particles together and a sintering of them to the electrode pads of the silicon die; and e. The overcoat of the die/substrate with a protective coat. ### Claim 14 (depends on 13) The process of claim 13 in which the metal toner is made of silver. ### Claim 15 (depends on 13) The process of claim 13 in which the substrate is PET film or paper. ### Claim 16 (depends on 13) The process of claim 13 in which the substrate is coated with an adhesion/sintering layer that promotes both sintering of the metal particles and their adhesion to the substrates. ### Claim 17 (depends on 16) The process of claim 16 in which this coating is chosen from Saran™ resins of Dow Chemical. ### Claim 18 A process for the manufacture of rf-ID devices in which: a. metal toner is printed on a suitable substrate in a suitable pattern; b. the pattern in the area of silicon chip mounting is configured into a single or multui-turn electro-magnetic coil; c. this pattern is suitably processed into a conductive metal pattern; d. the substrate is coated with a suitable adhesive layer; e. a silicon die possessing an electromagnetic coil pattern of metal around its periphery is placed and aligned to the metal toner coil pattern of the substrate; and f. the bonding reaction between die and adhesive coated substrate is completed by suitable means. ### Claim 19 (depends on 18) The process of claim 18 in which the die has been “thinned” to a value below 50 microns. ### Claim 20 (depends on 18) The process of claim 18 where the substrate thickness is less than 50 microns. ### Claim 21 (depends on 18) The process of claim 18 where the overall thickness of the final part is between 10 and 100 microns.