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US 2006/0069232 A1Published application
Underfill compositions and methods for use thereof
AssigneeDesigner Molecules, Inc.
InventorsStephen Dershem, Debbie Forray
Life of this patent
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Abstract
The invention is based on the discovery that certain polyester-linked compounds are useful as components in underfill compositions for the microelectonic packaging industry.
Claims24
An underfill composition comprising
- a) at least one compound having the structure:
- wherein:
- R and Q are each independently substituted or unsubstituted aliphatic, aryl, or heteroaryl;
- each E is independently an acrylate, methacrylate, ring-opening or ring-forming polymerizable moiety;
- and
- n is 1 to about 10;
- b) an acidic fluxing agent;
- and
- c) a filler.
6 more elements
Dependencies are inferred from the claim text.