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US 2006/0068684 A1Published application
Polishing method and polishing system
AssigneeKabushiki Kaisha Toshiba
InventorTakeo Kubota
Life of this patent
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Abstract
A polishing method includes supplying a slurry onto a pad disposed above a turntable while rotating the turntable, and polishing a workpiece disposed on the pad by pressing the workpiece to the pad, and detecting an ion concentration of a specific ion included in the slurry on the pad by using an ion test paper during the polishing.
Claims20
A polishing method, comprising:
- supplying a slurry onto a pad disposed above a turntable while rotating the turntable, and polishing a workpiece disposed on the pad by pressing the workpiece to the pad;
- and
- detecting an ion concentration of a specific ion included in the slurry on the pad by using an ion test paper during the polishing.
A polishing system, comprising:
- a turntable on which a pad is to be disposed, a prescribed location on the pad being provided with an ion test paper which detects an ion concentration of a specific ion included in a slurry on the pad;
- a nozzle which is disposed above the turntable and supplies the slurry onto the pad;
- a carrier which presses a workpiece against a top face of the pad;
- an image-pickup device which takes an image of the ion test paper while rotating the turntable, supplying the slurry from the nozzle onto the pad, and polishing the workpiece by using the carrier;
- and
- an analyzer which analyzes the ion concentration based on the picked-up image taken by the image-pickup device.
3 more elements
Dependencies are inferred from the claim text.