High density connector and method of manufacture
AssigneeFCI Americas Technology, Inc.
InventorsTimothy Lemke, Timothy Houtz
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AssigneeFCI Americas Technology, Inc.
InventorsTimothy Lemke, Timothy Houtz
Estimating the term…
Electrical connectors capable of being mounted on circuit substrates by BGA techniques are disclosed. Also, disclosed is a method of manufacturing such connectors. There is at least one recess on the exterior side of the connector elements. A conductive contact extends from adjacent the interior side into the recess on the exterior side of the housing. A controlled volume of solder paste is introduced into the recess. A fusible conductive element, in the form of solder balls is positioned in the recess. The connector is subjected to a reflow process to fuse the solder ball to the portions of the contact extending into said recess. Contacts are secured in the insulative housing of the connector by deformable sections that minimize stress imposed on the central portions of the contacts to promote uniformity of solder volume.
1-17. (canceled)
An electrical contact comprising:
An electrical connector adapted to be mounted on a substrate that includes a conductive element, the electrical connector comprising:
An electrical connector adapted to be mounted on a substrate that includes a conductive element, the electrical connector comprising:
The electrical connector as claimed in claim wherein the exterior side of the insulative housing and the exterior side of the contact each face the same direction.
A high density electrical connector mountable to a substrate having conductive elements therein and having a substrate mounting side and a mating side comprising:
A high density electrical connector mountable to a substrate having conductive elements therein comprising:
A method of making an electrical connector adapted to be mounted to a substrate and having a substrate mounting side and a mating side comprising:
Dependencies are inferred from the claim text.