Micro lens array with guide pin insertion holes and its manufacture method
AssigneeYamaha Corporation
InventorToshihiro Nakajima
Life of this patent
Estimating the term…
Abstract
A micro lens array has a translucent substrate of glass or the like and convex lenses formed on a principal surface of the substrate. Guide pin insertion holes are formed through the substrate 30 on opposite sides of a line of lenses. A metal layer 38 with at least three metal projections is formed only in an inner wall section of each of the holes by a plating process so as to gradually increase an opening size of the hole at higher positions. The inner wall section has a depth of about 50 to 100 μm from the opening end on the guide pin insertion side. The metal layer may be omitted. Instead of the metal projections, a metal layer forming the hole having a polygonal shape may be used.
Claims14
A component with guide pin insertion holes comprising:
- a first member formed with guide pin insertion holes into which guide pins are inserted;
- and
- a second member formed in an inner wall section of each of said guide pin insertion holes only in a limited depth section, said second member guiding a guide pin by a plurality of contact points dispersively disposed along a circumferential direction of an opening of said guide pin insertion hole.
A manufacture method for a component with guide pin insertion holes, comprising steps of:
- (a) forming a first resist pattern on a principal surface of a substrate, said first resist pattern having a first opening of hole and a second opening of groove continuous with said first opening;
- (b) performing a removal process using said first resist pattern as a mask to form a hole corresponding to said first opening and a first groove corresponding to said second opening along a depth direction of said substrate from a principal surface side;
- (c) removing said first resist pattern;
- (d) forming a plating underlying layer covering bottoms of said hole and said first groove;
- (e) plating a conductive layer covering said plating underlying layers to a thickness exposing inner wall sections of said hole and said first groove near opening ends;
- (f) forming a second resist pattern on said conductive layers, said second resist pattern dispersively defining a plurality of contact points when a guide pin is inserted into said hole;
- (g) forming a guide metal layer on said conductive layer by plating metal different from material of said conductive layer on said conductive layer, by using the second resist pattern as a mask;
- (h) removing said second resist pattern;
- (i) polishing said substrate from a bottom to expose said conductive layers;
- and
- (j) etching said conductive layers to leave said guide metal layer.
Dependencies are inferred from the claim text.