Wiring pattern formation method, wiring pattern, and electronic device
AssigneeSeiko Epson Corporation
InventorsTsuyoshi Shintate, Kazuaki Sakurada, Noboru Uehara
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Abstract
In a method of forming a wiring pattern, a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post. The method has forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring, and forming the conducting post by discharging a second droplet including a material for forming the conducting post, wherein a volume of the second droplet is greater than a volume of the first droplet.
Claims10
A method of forming a wiring pattern in which a plurality of electrical wirings deposited to be multilayered are conductively connected to one another through a conducting post, the method comprising:
- forming the electrical wiring by discharging a first droplet including a material for forming the electrical wiring;
- and
- forming the conducting post by discharging a second droplet including a material for forming the conducting post;
- wherein a volume of the second droplet is greater than a volume of the first droplet.
A method of forming a wiring pattern in which a plurality of electrical wirings multilayered are conductively connected to one another through a conducting post, the method comprising:
- writing and forming a liquid line by discharging a first droplet including a material for constituting the electrical wiring;
- tentatively drying a surface of the liquid line;
- writing and forming a liquid post on the liquid line by discharging a second droplet including a material for constituting the conducting post;
- and
- forming the electrical wirings and the conducting post by heating the liquid line and the liquid post.
Dependencies are inferred from the claim text.