Heat transfer device and system and method incorporating same

A method of manufacturing a heat transfer device, comprising:

• providing first and second thermally conductive substrates that are substantially atomically flat, one of the first or second thermally conductive substrates having a patterned electrical barrier surrounding a low work function material in at least an area oriented between the patterned electrical barrier in a configuration in which the first and second thermally conductive substrates are positioned opposite from one another;
• bonding the first and second thermally conductive substrates in the configuration;
• and
• extracting a unit having opposite sections of the first and second thermally conductive substrates, the unit having a portion of the patterned electrical barrier disposed about the low work function material, the portion defining a thermotunneling gap between the first and second thermally conductive substrates.

A method of manufacturing a heat transfer device, comprising:

• providing a plurality of units having opposite thermally conductive substrates, each having a patterned electrical barrier disposed about a low work function material to form a thermotunneling gap;
• mounting the plurality of units between opposite substrates;
• and
• electrically coupling the plurality of units.

A heat transfer device, comprising:

• first and second thermally conductive substrates that are positioned opposite from one another, wherein the first and second thermally conductive substrates are each substantially atomically flat;
• a patterned electrical barrier disposed between the first and second thermally conductive substrates on the first or second thermally conductive substrates;
• and
• a low work function material disposed between the first and second thermally conductive substrates on the first or second thermally conductive substrates in at least an area oriented between the patterned electrical barrier, wherein introduction of a current flow between the first and second thermally conductive substrates enables heat transfer between the first and second thermally conductive substrates via a flow of electrons between the first and second thermally conductive substrates.

A heat transfer system, comprising:

• a first object;
• a second object;
• and
• a heat transfer device adapted to transfer heat between the first and second objects, the heat transfer device comprising:
• first and second thermally conductive substrates that are substantially atomically flat;
• a patterned electrical barrier disposed on the first or second thermally conductive substrates;
• and
• a low work function material disposed on the first or second thermally conductive substrates in at least an area oriented between the patterned electrical barrier in a configuration in which the first and second thermally conductive substrates are positioned opposite from one another, wherein introduction of a current flow between the first and second thermally conductive substrates enables heat transfer between the first and second thermally conductive substrates via a flow of electrons between the first and second thermally conductive substrates.