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US 2006/0068595 A1Published application
Semiconductor substrate thinning method for manufacturing thinned die
AssigneeAdvanced Micro Devices, Inc.
InventorsFrank Seliger, Matthias Lehr, Marcel Wieland, Lothar Mergili, Frank Kuechenmeister
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Abstract
In a method according to the present invention, a substrate thinning process is performed on a bumped substrate prior to the ultimate solder reflow process to heal bump defects caused by the substrate thinning process. Concurrently, the risk of substrate breakage is reduced compared to the prior art process since the number of process steps, requiring handling of thinned substrates, is reduced.
Claims23
A method, comprising:
- providing a semiconductor substrate having formed thereon a plurality of exposed contact pads;
- forming solder bumps over said plurality of contact pads;
- reducing the thickness of the bumped substrate;
- and
- performing a solder reflow process after thinning of the substrate.
2 more elements
Dependencies are inferred from the claim text.