Integrated circuit package
AssigneeInfineon Technologies AG
InventorTiang Lin
Life of this patent
Estimating the term…
Abstract
Two integrated circuits 1, 3, 101, 103 having circuitry on one of their major surfaces 11, 31, 111, 131 are ground on their opposite major surfaces 13, 33 to reduce their thickness. The ground integrated circuits are then adhered together to form a composite body 7 and placed in a chamber 97, 197 formed within a substrate 9, 109 such as a printed circuit board. Electrical connections are formed between contacts 15, 35, 115, 135 of the integrated circuits 1, 3, 101, 103 and contacts 92, 192 of the substrate 9, 109. Components 22 may be mounted on the outer surfaces 24 of the substrate 9, 109.
Claims20
A method of packaging two integrated circuits, each of the integrated circuits having circuitry on a first major surface, the method comprising:
- grinding a second major surface of each of first and second integrated circuits;
- positioning the first and second integrated circuits with their second major surfaces facing one another within a chamber formed within a substrate;
- and
- forming electrical connections between electric contacts of the first integrated circuit and electrical contacts of the substrate, and between electric contacts of the second integrated circuit and electrical contacts of the substrate.
A method of making an electronic component, the method comprising:
- providing first and second integrated circuits each having a first and a second major surface, each of the integrated circuits having circuitry on the first major surface;
- positioning the first and second integrated circuits with their second major surfaces facing one another within a chamber formed within a substrate;
- and
- forming electrical connections between electric contacts of the first integrated circuit and electrical contacts of the substrate, and between electric contacts of the second integrated circuit and electrical contacts of the substrate.
An integrated circuit package comprising:
- a substrate defining a chamber;
- a first integrated circuit located within the chamber, the first integrated circuit having circuitry on a first major surface and having a thickness less than that of the substrate;
- a second integrated circuit located within the chamber such that second major surfaces of the first and second integrated circuits face one another, the second integrated circuit having circuitry on a first major surface;
- and
- electrical connections between electric contacts of the first integrated circuit and electrical contacts of the substrate, and between electric contacts of the second integrated circuit and electrical contacts of the substrate.
Dependencies are inferred from the claim text.