Positive resist composition and pattern forming method using the same
AssigneeFuji Photo Film Co., Ltd.
InventorTomoya Sasaki
Life of this patent
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Abstract
A positive resist composition satisfying high sensitivity, high resolution and good line edge roughness at the same time, and a pattern forming method using the composition, are provided, which is a positive resist composition comprising (A) a resin of which solubility in an alkali developer increases under the action of an acid, the resin containing a repeating unit having a specific styrene skeleton and a repeating unit having a specific ring structure, and (B) a compound of generating an acid upon irradiation with actinic rays or radiation; and a pattern forming method using the composition.
Claims19
A positive resist composition comprising:
- (A) a resin of which solubility in an alkali developer increases under the action of an acid, the resin containing a repeating unit represented by formula (I) and a repeating unit having a cyclic structure in the main chain;
- and (B) a compound of generating an acid upon irradiation with actinic rays or radiation:
- wherein
- R1 represents a hydrogen atom, a methyl group, a cyano group, a halogen atom or a perfluoro group,
- R2 represents a non-acid-decomposable group, and when n represents an integer of 2 to 4, a plurality of R2s may be the same or difference,
- X represents a hydrogen atom or an organic group, and when m represents an integer of 2 to 4, a plurality of Xs may be the same or difference,
- m represents an integer of 1 to 4, and
- n represents an integer of 1 to 4, provided that 2≦n+m≦5.
Dependencies are inferred from the claim text.