Ag-based reflection film and method for preparing the same
OwnerSadayuki Ukishima, Satoru Ishibashi +2inventors
InventorsSadayuki Ukishima, Satoru Ishibashi, Shigeru Saitou, Poong Kim
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OwnerSadayuki Ukishima, Satoru Ishibashi +2inventors
InventorsSadayuki Ukishima, Satoru Ishibashi, Shigeru Saitou, Poong Kim
Estimating the term…
An Ag-based reflection film consists of a laminate film comprising an Ag or Ag-alloy film provided thereon with a quite thin capping layer. The Ag-based reflection film can be prepared by, for instance, forming, on a substrate, an Ag or Ag-alloy film according to the sputtering technique, while using a sputtering target, for instance, having a composition corresponding to that of the pure Ag film, and Ar gas as a sputtering gas, while adding an additional gas such as O2, only at the initial stage of the Ag or Ag-alloy film-forming step; and then forming a quite thin capping layer, on the Ag or Ag-alloy film, according to the sputtering technique, while using a sputtering target having a composition corresponding to that of the capping layer, and Ar gas as a sputtering gas, while if necessary adding an additional gas such as O2. The Ag-based reflection film can maintain a high reflectance without causing any deterioration thereof even under the severe conditions such as those for the hydrogen sulfide-exposure test because of the presence of a quite thin capping layer. The reflection film may be applied to, for instance, those used for display devices and optics-relating ones.
An Ag-based reflection film consisting of a laminate film, which comprises an Ag or Ag-alloy film and a quite thin capping layer applied onto the Ag or Ag-alloy film.
A method for the p reparation of an Ag-based reflection film comprising the steps of forming, on the surface of a substrate, an Ag or Ag-alloy film according to the sputtering technique, while using a sputtering target having a composition selected from the group consisting of pure Ag, Ag/Au alloy, Ag/Au/Sn alloy, Ag/Pd alloy and Ag/Pd/Cu alloy or corresponding to that of the Ag/Au/Sn type alloy film or Ag/Au/Sn type alloy which comprises Ag as a principal component, 0.1 to 4.0 at % of Au and 0.1 to 2.5 at % of Sn and a sputtering gas consisting of Ar gas, while adding, as an additional gas, at least one oxygen-containing gas selected from the group consisting of O2, H2O, and H2+O2 only at the initial stage of the Ag or Ag-alloy film-forming step;
Dependencies are inferred from the claim text.