Nano-sized metals and alloys, and methods of assembling packages containing same
AssigneeIntel Corporation
InventorsFay Hua, C. Garner
Life of this patent
Estimating the term…
Abstract
A nano-sized metal particle composition includes a first metal that has a particle size of about 20 nanometer or smaller. The nano-sized metal particle can include a second metal that forms a shell about the first metal. A microelectronic package is also disclosed that uses the nano-sized metal particle composition. A method of assembling a microelectronic package is also disclosed. A computing system is also disclosed that includes the nano-sized metal particle composition.
Claims32
A metal particle composition comprising:
- a first metal including a particle size in a range of less than or equal to about 20 nanometer (nm), and wherein the metal composition includes a melting temperature equal to or below about 300° C.
A process comprising:
- reflowing a metal particle composition including a first metal including a particle size in a range of less than or equal to about 20 nanometer (nm).
A package comprising:
- a substrate;
- and
- a reflowed metal particle composition on the substrate, wherein the reflowed metal particle composition includes a grain size in a range of less than or equal to about 20 micrometer (μm).
A method of assembling a microelectronic device package, comprising:
- forming a metal particle precursor upon a die, wherein the metal particle includes a first metal including a particle size in a range of less than or equal to about 20 nanometer (nm), and wherein the metal particle composition includes a melting temperature equal to or below about 400° C.;
- and
- coupling the die to one of a mounting substrate and a heat spreader.
A computing system comprising:
- a microelectronic die disposed upon a mounting substrate;
- a metal particle composition that contacts the die, the metal particle including:
- a first metal including a grain size in a range of less than or equal to about 20 micrometer (μm), and wherein the metal particle composition includes a melting temperature equal to or below about 400° C.;
- at least one of an input device and an output device coupled to the die-attach solder bump;
- and
- dynamic random access data storage coupled to the microelectronic die.
Dependencies are inferred from the claim text.