Low temperature polyimide adhesive compositions and methods relating thereto

A method of bonding an integrated circuit chip to a lead frame comprising:

• (1) preparing a polyamic acid solution, said polyamic acid solution comprising a product derived from contacting an aromatic dianhydride with a diamine component in one or more steps, said diamine component consisting essentially of a mixture of about 50 to about 90 mole % of an aliphatic diamine and about 10 to about 50 mole % of an aromatic diamine,
• (2) applying the polyamic acid solution in one or more steps upon or in a close proximity to either an integrated circuit chip or a lead frame,
• (3) removing at least a portion of the organic solvent and imidizing at least a portion of the polyamic acid solution to form a polyimide, due at least in part to an interaction with a heat of sufficient energy to increase the temperature of ambient air at least 10, 20, 30, 40, 50 or 60° C., and
• (4) creating or allowing a contact between said integrated circuit chip and said lead frame, sufficient to cause, in whole or in part, a bond between said integrated circuit chip and said lead frame.