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AssigneeE.I. du Pont de Nemours and Company
InventorKuppusamy Kanakarajan
Estimating the term…
The present invention relates to a polyimide adhesive composition having a polyimide derived from an aromatic dianhydride and a diamine component, where the diamine component is preferably about 50 to 90 mole % of an aliphatic diamine and about 10 to 50 mole % of an aromatic diamine. In one embodiment, the aliphatic diamine has the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16 and the polyimide adhesive has a glass transition temperature in the range of from 150° C. to 200° C. The present invention also relates to compositions comprising the polyimide adhesive of the present invention, including polyimide metal-clad laminate useful as flexible circuit when metal traces are formed out of the metal used in flexible, rigid, or flex-rigid circuit applications.
1-10. (canceled)
A multi-layer polyimide composite comprising a first layer and a second layer wherein the first layer comprises a polyimide adhesive composition in accordance with claim 2, and wherein the second layer is a polyimide with a glass transition temperature greater than 250° C.
A three-layer polyimide composite comprising two outer layers and one inner layer wherein the two outer layers are a polyimide adhesive composition in accordance with claim 3, and wherein the inner layer is a polyimide with a glass transition temperature greater than 250° C.
A two-layer polyimide composite comprising a first layer and a second layer wherein the first layer comprises a polyimide adhesive composition in accordance with claim 3 and wherein the second layer is a polyimide with a glass transition temperature greater than 250° C., said two-layer polyimide composite further comprising a metal layer bonded to said first layer.
A three-layer polyimide composite comprising two outer layers and one inner layer wherein the two outer layers are a polyimide adhesive composition in accordance with claim 2, and wherein the inner layer is a polyimide with a glass transition temperature greater than 250° C., said three-layer polyimide composite further comprising two metal layers, an upper metal layer and a lower metal layer, wherein the upper metal layer is bonded to one said outer layer, and wherein the lower metal layer is bonded to the other said outer layer.
(canceled)
A flexible polyimide metal-clad laminate having a polyimide adhesive layer and a metal layer, wherein the polyimide adhesive comprises a polyimide base polymer, the base polymer being synthesized by contacting an aromatic dianhydride component with a diamine component, wherein the diamine component is 50 to 90 mole % aliphatic diamine and 10 to 50 mole % aromatic diamine, the polyimide base polymer having a glass transition temperature from about 150, 160, 170, 180, or 185 to about 190, 195, 197 or 200° C.
21-31. (canceled)
Dependencies are inferred from the claim text.