Film forming method
AssigneeTri Chemical Laboratories Inc.
InventorsHideaki Machida, Yoshio Ohshita, Atsushi Ogura, Masato Ishikawa
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AssigneeTri Chemical Laboratories Inc.
InventorsHideaki Machida, Yoshio Ohshita, Atsushi Ogura, Masato Ishikawa
Estimating the term…
A technique is provided that is capable of employing raw materials having no halogen, which has a high possibility of exerting a bad influence upon semiconductor elements, thereby to easily form tungsten films (tungsten silicide films or tungsten nitride films) of which purity is high at a low temperature. A film forming material for forming tungsten films, tungsten silicide films, or tungasten nitride films is provided, wherein a W source of said film is one or more chemical compounds selected from the group consisting of a biscyclopentadienyltungsten dihydride, a bismethylcyclopentadienyltungsten dihydride, a bisethylcyclopentadienyltungsten dihydride, and a bisisopropylcyclopentadienyltungsten dihydride.
A method of forming a film containing tungsten, comprising:
A method of forming a film containing W and Si wherein said film is a tungsten silicide film, comprising:
A method of forming a film containing W and N wherein said film is a tungsten nitride film, comprising:
Dependencies are inferred from the claim text.