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US 2006/0067656 A1Published application
Micromechanically manufactured infrared transmitter
AssigneeEADS Deutschland GmbH
InventorsGerhard Mueller, Olaf Schulz, Simon Ahlers, Jan Spanhake, Martin Lloyd
Life of this patent
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Abstract
A micromechanical infrared radiator has a radiator surface supported in a carrier chip. The radiator surface can be heated by a heating device. As a function of a temperature measurement, the heating power can be controlled such that the radiator surface assumes a defined temperature. For direct temperature measurement, a micromechanical temperature sensor in the form of a metal resistance is integrated in the radiator surface.
Claims9
A micromechanical infrared radiator comprising:
- a carrier chip;
- and
- a radiator surface formed in said carrier chip, which radiator surface is heatable by a heating device, with a heating power that is controllable as a function of a temperature measurement, such that the radiator surface assumes a defined temperature;
- wherein, for the direct temperature measurement, a micromechanical temperature sensor in the form of a metal resistance is integrated with the radiator surface.
1 more element
An micromechanical infrared radiator, comprising:
- a carrier chip having a centrally situated opening therein;
- a radiator surface formed integrally with said carrier chip and supported in said opening by integrally formed supporting webs;
- and
- a micromechanical temperature sensor in the form of an elongated linear metal resistance which extends transversely across a surface of said carrier chip and is integrated with the radiator surface.
1 more element
Dependencies are inferred from the claim text.