Apparatus and method for reducing slippage between structures in an interferometric modulator

An interferometric modulator comprising:

• a means for supporting a moveable layer over a fixed layer;
• and
• a means for bonding the support means to at least one of the fixed layer and the moveable layer;
• the bonding means being configured to provide improved adhesion between the support means and at least one of the fixed layer and the moveable layer.

A method of making an interferometric modulator, comprising:

• forming a substrate layer, the substrate layer comprising a first reflective surface;
• treating at least a portion of a support region of the substrate layer to form a treated support region;
• and
• forming a support structure on the treated support region;
• the treated support region being configured to increase adhesion between the substrate layer and the support structure.

A method of making an interferometric modulator, comprising:

• forming a substrate layer;
• forming a support structure on the substrate layer;
• treating the support structure to form a treated support structure;
• and
• forming a moveable layer on the treated support structure.