Method and device for packaging a substrate
AssigneeIdc, LLC
InventorsLauren Palmateer, William Cummings, Brian Gally, Mark Miles, Jeffrey Sampsell, Clarence Chui, Manish Kothari
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Abstract
A package structure and method of packaging for an interferometric modulator. A thin film material is deposited over an interferometric modulator and transparent substrate to encapsulate the interferometric modulator. A gap or cavity between the interferometric modulator and the thin film provides a space in which mechanical parts of the interferometric modulator may move. The gap is created by removal of a sacrificial layer that is deposited over the interferometric modulator.
Claims33
A display device, comprising:
- a transparent substrate;
- an interferometric modulator configured to modulate light transmitted light said transparent substrate;
- and
- a thin film backplane disposed on said modulator and sealing said modulator within a package between said transparent substrate and said thin film backplane.
A method of manufacturing a display device, comprising:
- providing a transparent substrate;
- forming an interferometric modulator on the transparent substrate;
- and
- depositing a thin film backplane over the interferometric modulator and the transparent substrate to seal said modulator between said transparent substrate and said thin film backplane.
A microelectromechanical systems display device, comprising:
- a transparent substrate;
- an interferometric modulator formed on the transparent substrate;
- and
- a thin film backplane sealed to the transparent substrate to encapsulate the interferometric modulator between the transparent substrate and the thin film backplane, wherein a cavity exists between the interferometric modulator and the thin film backplane.
A display device, comprising:
- a transparent substrate;
- an interferometric modulator configured to modulate light transmitted through the transparent substrate, wherein the interferometric modulator is formed on the transparent substrate;
- a thin film backplane deposited over the interferometric modulator, wherein the thin film backplane seals the modulator within a package between the transparent substrate and the thin film backplane;
- and
- a cavity between the modulator and the thin film backplane, wherein the cavity is formed by removing a sacrificial material.
A display device, comprising:
- a transmitting means for transmitting light therethrough;
- a modulating means configured to modulating light transmitted through the transmitting means, wherein the modulating means comprises an interferometric modulator;
- and
- a sealing means for sealing the modulating means within a package between the transmitting means and the sealing means, wherein the sealing means comprises a thin film.
Dependencies are inferred from the claim text.