Optical package
AssigneeIntel Corporation
InventorsDaoqiang Lu, Henning Braunisch, Gilroy Vandentop
Life of this patent
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Abstract
Optical packages are disclosed. In one aspect, an optical package may include a surface, a microelectronic device coupled with the surface, a first waveguide coupled with the microelectronic device, a second waveguide having a first end that is evanescently coupled with the first waveguide and a second end, a first thickness of a cladding material disposed between the second end and the surface, and a second thickness of a cladding material disposed between the first end and the first waveguide. The first thickness may be greater than the second thickness. Methods of making the optical packages are also disclosed. Apparatus and methods of aligning operations on optical packages are also disclosed.
Claims29
An apparatus comprising:
- a cooling device and a microelectronic device coupled with the cooling device;
- an on-device waveguide coupled with the microelectronic device;
- a second waveguide, which is larger than the on-device waveguide, evanescently coupled with the on-device waveguide;
- and
- a first thickness of cladding material disposed between the second waveguide and the cooling device, and a second thickness of cladding material, which is thinner than the first thickness, disposed between the on-device waveguide and the second waveguide.
An apparatus comprising:
- a surface, a microelectronic device coupled with the surface, and a first waveguide coupled with the microelectronic device;
- a second waveguide having a first end and a second end;
- a first thickness of a cladding material disposed between the second end and the surface;
- and
- a second thickness of a cladding material disposed between the first end and the first waveguide, wherein the first thickness is greater than the second thickness.
A system comprising:
- a bus;
- a dynamic random access memory coupled with the bus;
- and
- a package coupled with the bus, the package including:
- a surface, a microelectronic device coupled with the surface, and a first waveguide coupled with the microelectronic device;
- a second waveguide having a first end and a second end;
- a first thickness of a cladding material disposed between the second end and the surface;
- and
- a second thickness of a cladding material waveguide disposed between the first end and the first waveguide, wherein the first thickness is greater than the second thickness.
A method comprising:
- forming a first layer of cladding material over a surface around a microelectronic device;
- forming a second layer of cladding material, which is thinner than the first layer of cladding material, over an on-device waveguide that is coupled with the microelectronic device;
- forming a second waveguide, which is larger than the on-device waveguide, over the first layer of cladding material, and over the second layer of cladding material.
A method comprising:
- emitting light from one or more waveguides of an apparatus;
- and
- aligning an operation on the apparatus based on the light emitted from the one or more waveguides.
An apparatus comprising:
- a solid material, a microelectronic device coupled with the solid material, and an optical device coupled with the microelectronic device;
- one or more through waveguides coupled with the solid material;
- optically uncoupled ends of the one or more through waveguides;
- and
- one or more alignment structures accurately positioned on the solid material relative to the uncoupled ends.
Dependencies are inferred from the claim text.