Method and system for vertical optical coupling on semiconductor substrate
AssigneeSTMicroelectronics S.r.l.
InventorsMing Fang, Larry Tullos, Hai Ding
Life of this patent
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Abstract
Connection between optical fibers and optical components within a semiconductor substrate. A lens is created at the front of a semiconductor substrate. A tapered hole is created in the back of the substrate exposing part or all of the surface of the lens. An optical component is formed or affixed at the front surface of the substrate. A volume of transparent adhesive is placed in the hole, followed by an optical fiber, which is thus coupled to the surface of the lens. A light guide is created on the front of the substrate overlying the lens to direct optical signals between the optical fiber inserted in the tapered hole and the optical component on the surface of the substrate.
Claims20
A method for coupling an optical fiber to an optical component comprising:
- forming a hole in a semiconductor substrate extending from a first side of the substrate towards a second side thereof, the hole configured to receive an optical fiber extending into the hole from the first side towards the second;
- and
- forming an optical component on the second side of the substrate over the hole, positioned such that light from the optical fiber is incident on the optical component.
A device for coupling an optical fiber, comprising:
- a semiconductor substrate;
- a hole in the semiconductor substrate penetrating from a first surface of the substrate toward a second surface thereof, and configured to receive the optical fiber therein;
- and
- an optical component formed on the second surface of the semiconductor substrate and overlaying the hole such that light from the optical fiber is incident on the optical component.
Dependencies are inferred from the claim text.