Thermally conductive composite and uses for microelectronic packaging
OwnerKenneth Heffner, Scott Fleischman +1inventors
InventorsKenneth Heffner, Scott Fleischman, William Dalzell
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Abstract
The present invention provides thermally conductive, electrically insulating composites that can be used to help conduct heat away from a heat source such as from microelectronic structures that generate heat during use. In one aspect, the present invention relates to an electronic system comprising a microelectronic device and a thermally conductive, composite in thermal contact with the microelectronic device. The composite is derived from ingredients comprising a macrocyclic oligomer; and a thermally conductive filler comprising diamond.
Claims49
A thermally conductive composite, said composite being derived from ingredients comprising
- a. a macrocyclic oligomer;
- and
- b. a thermally conductive filler comprising diamond.
A method of making a thermally conductive composite, comprising the step of incorporating a thermally conductive filler into a matrix derived from ingredients comprising a macrocyclic oligomer, wherein the thermally conductive filler comprises diamond.
An electronic system, comprising:
- a) a microelectronic device or power supply component(s);
- b) a thermally conductive, composite in thermal contact with the microelectronic device or power supply component(s), said composite being derived from ingredients comprising
- i. a macrocyclic oligomer;
- and
- ii. a thermally conductive filler comprising diamond.
A spacecraft comprising a microelectronic device and a thermally conductive, composite in thermal contact with the microelectronic device, said composite being derived from ingredients comprising:
- a) a macrocyclic oligomer;
- and
- b) a thermally conductive filler comprising diamond.
An electronic system, comprising
- a) a heat source comprising a microelectronic device;
- b) a heat-dissipating radiator;
- and
- c) a thermal pathway interconnecting the heat source and the radiator, said pathway comprising a thermally conductive, composite comprising
- i. a macrocyclic oligomer;
- and
- ii. a thermally conductive filler comprising diamond.
A method of making a microelectronic device, comprising the step of encapsulating at least a portion of the device with a thermally conductive, composite, said coating being derived from ingredients comprising a macrocyclic oligomer and a thermally conductive filler comprising diamond.
A thermally conductive composite, said composite being derived from ingredients comprising
- a) a macrocyclic oligomer;
- and
- b) a thermally conductive filler comprising diamond.
Dependencies are inferred from the claim text.