System and method for cooling electronic systems
AssigneeGeneral Electric Company
InventorsSubhrajit Dey, Petrus Joannes Moeleker, Chellappa Balan
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Abstract
A cooling system for cooling a plurality of electronic components comprises a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium and a plurality of baffles configured to redistribute the cooling medium over the electronic components. The electronic components are situated in an enclosure.
Claims50
A cooling system for cooling a plurality of electronic components, said cooling system comprising:
- a centralized source comprising at least one micro cooler configured to deliver a flow of a cooling medium;
- and
- a plurality of baffles configured to redistribute said cooling medium over said electronic components;
- wherein said electronic components are situated in an enclosure;
- and
- wherein said centralized source is capable of delivering said flow of cooling medium at sufficiently high pressure to overcome pressure losses in said enclosure.
A cooling system for cooling a plurality of electronic components comprising at least one CPU and a set of remaining electronic components, said cooling system comprising:
- a centralized source configured to deliver a flow of a cooling medium to said at least one CPU and generate an exit stream of said cooling medium;
- and
- a plurality of baffles configured to redistribute said exit stream to cool said remaining set of electronic components;
- wherein said at least one CPU and remaining set of electronic components are situated in an enclosure;
- and
- wherein said centralized source is capable of delivering said flow of cooling medium at sufficiently high pressure to overcome pressure losses in said enclosure.
A method for cooling a plurality of electronic components disposed within an enclosure, said method comprising:
- delivering a cooling medium from a centralized source comprising at least one micro cooler;
- and
- redistributing said cooling medium using a plurality of baffles over said plurality of electronic components;
- wherein said delivering comprises delivering a flow of cooling medium at sufficiently high pressure to overcome pressure losses in the enclosure.
A method for cooling a plurality of electronic components comprising at least one CPU and a remaining set of electronic components disposed within an enclosure, said method comprising:
- delivering a cooling medium from a centralized source;
- distributing said cooling medium over said at least one CPU and generating an exit stream;
- redistributing said exit stream using a plurality of baffles over said remaining set of electronic components;
- wherein said delivering comprises delivering a flow of cooling medium at sufficiently high pressure to overcome pressure losses in the enclosure.
Dependencies are inferred from the claim text.