Decoupling capacitor for an integrated circuit and method of manufacturing thereof

A decoupling capacitor module comprising:

• a plurality of conductive power layers providing a first capacitor plate;
• a plurality of conductive ground layers providing a second capacitor plate;
• a plurality of insulative layers, said power layers and said ground layers alternating along a dimension of the decoupling capacitor module, with at least one of the insulative layers located between the alternating power and ground layers,
• a first set of leads coupled to the power layers;
• and
• a second set of leads coupled to the ground layers.

An electrical interposer for connecting between a semiconductor die and a circuit board, comprising:

• an insulating body including a first side adapted to receive a semiconductor device and a second side adapted for mounting to a circuit board;
• a plurality of electrically conductive pins extending through holes in the insulating body from the first side to the second side of the insulating body, the pins adapted to connect to the semiconductor device and to the circuit board;
• and
• a decoupling capacitor module disposed in said insulating body, the decoupling capacitor module comprising a plurality of conductive power layers, a plurality of conductive ground layers, and a plurality of insulative layers, the power layers and the ground layers alternating along a dimension of the decoupling capacitor module, with at least one of the insulative layers located between the alternating power and ground layers, a first set of leads coupled to the power layers;
• and a second set of leads coupled to the ground layers, the first and second sets of leads sized and spaced for electrical connection to the semiconductor die, the conductive paths sized and spaced for electrical connection to the semiconductor device and to the circuit board.