Back to results
US 2006/0067030 A1Published application
Array capacitor with IC contacts and applications
AssigneeIntel Corporation
InventorsKaladhar Radhakrishnan, Larry Mosley, Dustin Wood, Nicholas Holmberg
Life of this patent
Estimating the term…
Abstract
An apparatus comprises a first plurality of contacts on a first side of the apparatus adapted to interface with a corresponding plurality of contacts on an integrated circuit package. The apparatus further comprises a second plurality of contacts on a second side of the apparatus adapted to interface with a corresponding plurality of grid array leads and a plurality of capacitive storage structures coupled to the first and second plurality of contacts.
Claims19
A apparatus comprising:
- a first plurality of contacts on a first side adapted to interface with a corresponding plurality of contacts on an integrated circuit package;
- a second plurality of contacts on a second side adapted to interface with a corresponding plurality of grid array leads;
- and
- a plurality of capacitive storage structures selectively coupled to the first and second plurality of contacts.
1 more element
An apparatus comprising:
- a package substrate;
- an integrated circuit coupled to the package substrate;
- and
- an array capacitor coupled to the package substrate, the array capacitor comprising:
- a first plurality of contacts on a first side adapted to interface with a corresponding plurality of contacts on the package substrate;
- a second plurality of contacts on a second side adapted to interface with a corresponding plurality of grid array leads;
- and
- a plurality of capacitive storage structures selectively coupled to the first and second plurality of contacts.
5 more elements
A system comprising:
- a package substrate;
- an integrated circuit coupled to the package substrate;
- an array capacitor coupled to the package substrate, the array capacitor comprising:
- a first plurality of contacts on a first side adapted to interface with a corresponding plurality of contacts on the package substrate;
- a second plurality of contacts on a second side adapted to interface with a corresponding plurality of grid array leads;
- and
- a plurality of capacitive storage structures selectively coupled to the first and second plurality of contacts;
- a mass storage device;
- and
- at least one bus coupled between the integrated circuit and the mass storage device to facilitate data exchange between the integrated circuit and the mass storage device.
7 more elements
Dependencies are inferred from the claim text.