Multilayered structure, multilayered structure array and method of manufacturing the same

A multilayered structure array comprising plural multilayered structures arranged in a one-dimensional manner, each of said plural multilayered structures including:

• a first internal electrode layer;
• a dielectric layer formed on said first internal electrode layer;
• a second internal electrode layer formed on said dielectric layer;
• a first coating formed on an end surface of said first internal electrode layer in a first side surface region of said multilayered structure and containing one of metal oxide, metal nitride, metal fluoride and metal sulfide in at least one part thereof;
• and
• a second coating formed on an end surface of said second internal electrode layer in a second side surface region different from said first side surface region of said multilayered structure and containing one of metal oxide, metal nitride, metal fluoride and metal sulfide in at least one part thereof.

A multilayered structure array comprising plural multilayered structures arranged in a two-dimensional manner, each of said plural multilayered structures including:

• a first internal electrode layer;
• a dielectric layer formed on said first internal electrode layer;
• a second internal electrode layer formed on said dielectric layer;
• a first coating formed on an end surface of said first internal electrode layer in a first side surface region of said multilayered structure and containing one of metal oxide, metal nitride, metal fluoride and metal sulfide in at least one part thereof;
• and
• a second coating formed on an end surface of said second internal electrode layer in a second side surface region different from said first side surface region of said multilayered structure and containing one of metal oxide, metal nitride, metal fluoride and metal sulfide in at least one part thereof.

A method of manufacturing a multilayered structure comprising the steps of:

• (a) forming a first dielectric layer;
• (b) disposing a conducting material on said first dielectric layer to form a first internal electrode layer;
• (c) forming a second dielectric layer on said first internal electrode layer;
• (d) disposing a conducting material on said second dielectric layer to form a second internal electrode layer;
• (e) forming at least one groove in a workpiece including said first dielectric layer, said first internal electrode layer, said second dielectric layer and said second internal electrode layer formed at steps (a) to (d) to produce plural structures partially connected to one another and expose the end surfaces of said first and second internal electrode layers on a first side surface region and a second side surface region different from said first side surface region of each structure respectively, and selectively forming a first conducting material film and a second conducting material film on end surfaces of said first and second internal electrode layers respectively;
• and
• (f) causing at least one part of each of said first and second conducting material films formed at step (e) to have insulation to form a first coating and a second coating.