Interferometric optical modulator using filler material and method
AssigneeIdc, LLC
InventorsClarence Chui, Jeffrey Sampsell
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Abstract
Described is an apparatus, method for manufacturing, and systems comprising a MEMS device, for example, an interferometric modulator, comprising a substrate, a movable mirror, a deformable layer, and a support structure. In some embodiments, the support structure comprises a plurality of support posts. A connector secures the movable mirror secured to the deformable layer. At least one of the connector and the support post is a composite comprising a first component and a second component, where at the first component forms at least a portion of at least one of the perimeter of the connector and support post.
Claims37
A microelectromechanical systems device comprising:
- a substrate;
- a deformable layer;
- a support structure supporting the deformable layer;
- a movable conductor positioned between the substrate and the deformable layer;
- and
- a connector securing the movable conductor to the deformable layer;
- wherein
- at least one of the connector and the support structure comprises a first component and a second component,
- at least a portion of the first component is disposed on the perimeter of at least one of the connector and the support structure;
- and
- the first component comprises a non-electrically conductive filler material.
A method for fabricating an optical modulator comprising:
- forming over a substrate, a layer of a first sacrificial material, a mirror, and a layer of a second sacrificial material;
- forming a first opening through the layer of the second sacrificial material thereby exposing the mirror;
- and
- filling at least a portion of the sides of the opening with a filler material.
A microelectromechanical systems device comprising:
- a deformable conductive layer;
- a movable conductive layer;
- an electrically conductive core extending between the deformable conductive layer and the movable conductive layer;
- and
- a layer of a non-electrically conductive material surrounding the conductive core.
A microelectromechanical systems device comprising:
- a substrate;
- a layer of a first sacrificial material formed over the substrate;
- a conductor formed over the layer of the first sacrificial material;
- a layer of a second sacrificial material formed over the conductor;
- a first opening through the layer of the second sacrificial material, wherein the first opening exposes the conductor;
- and
- a means for filling discontinuities in first opening with a filler material.
A microelectromechanical systems device comprising:
- a movable conductor;
- a means for supporting the movable conductor;
- a means for communicating electrical signals between the movable conductor and the means for supporting the movable conductor;
- and
- a means for facilitating formation of the means for communicating electrical signals.
Dependencies are inferred from the claim text.