Calibration of thermal sensors for semiconductor dies
AssigneeIntel Corporation
InventorsSandeep Jain, Animesh Mishra, Jun Shi, Pochang Hsu, David Wyatt
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Abstract
A thermal management system is described which may be implemented on a semiconductor die. The system may include a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output. The adjustable compensation circuit may be applied to the thermal sensor or to a threshold.
Claims25
An apparatus comprising:
- a semiconductor die;
- a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature;
- and
- an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output.
A memory system comprising:
- a plurality of memory cells on a semiconductor die;
- a buffer on the semiconductor die to interface between the memory cells and an external agent;
- a thermal sensor thermally coupled to the semiconductor die to sense the temperature of the die and generate an output representing the sensed temperature;
- and
- an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output.
A computer system comprising:
- a processor;
- and
- a system memory coupled to the processor, the system memory having a semiconductor die, a thermal sensor thermally coupled to the die to sense the temperature of the die and generate an output representing the sensed temperature, and an adjustable compensation circuit coupled to the thermal sensor to compensate the thermal sensor output.
A method comprising:
- coupling a thermal device integrated on a semiconductor die to a known voltage;
- comparing a thermal voltage output of the thermal device to a reference voltage;
- and
- switching pull-down legs of a push-pull network based on the comparison.
An article comprising a machine readable medium including data that when accessed by a machine causes the machine to perform operations comprising:
- coupling a thermal device integrated on a semiconductor die to a known voltage;
- comparing a thermal voltage output of the thermal device to a reference voltage;
- and
- switching pull-down legs of a push-pull network based on the comparison.
Dependencies are inferred from the claim text.