Semiconductor device
AssigneeRohm Co., Ltd.
InventorKunihiro Komiya
Life of this patent
Estimating the term…
Abstract
The semiconductor device has the CSP structure, and includes: a plurality of electrode pads formed on a semiconductor integrated circuit in order to input/output signals from/to exterior; solder bumps for making external lead electrodes; and rewiring. The solder bumps are arranged in two rows along the periphery of the semiconductor device. The electrode pads are arranged inside the outermost solder bumps so as to be interposed between the two rows of solder bumps. Each trace of the rewiring is extended from an electrode pad, and is connected to any one of the outermost solder bumps or any one of the inner solder bumps.
Claims9
A semiconductor device comprising:
- a semiconductor substrate having an integrated circuit formed thereon;
- a plurality of electrode pads formed on the semiconductor substrate, being intended for input and output of signals between the integrated circuit and an external circuit;
- and
- a plurality of external electrodes connected to the plurality of electrode pads via rewiring, the external electrodes making connection terminals for the external circuit,
- wherein the plurality of external electrodes include a first group of external electrodes arranged along an edge of the semiconductor substrate and a second group of external electrodes arranged inside the first group of external electrodes, and
- wherein the plurality of electrode pads are arranged between the first group of external electrodes and the second group of external electrodes, and are each connected to an external electrode included in either the first group of external electrodes or the second group of external electrodes via the rewiring.
A semiconductor device comprising:
- a semiconductor substrate having an integrated circuit formed thereon;
- a plurality of electrode pads formed on the semiconductor substrate, being intended for input and output of signals between the integrated circuit and an external circuit;
- and
- a plurality of external electrodes connected to the plurality of electrode pads via rewiring, the external electrodes making connection terminals for the external circuit,
- wherein the plurality of external electrodes include a first row of group of external electrodes arranged linearly, and a second row of group of external electrodes arranged linearly in parallel with the first row of group of external electrodes, and
- wherein some of the plurality of electrode pads are located in an area interposed between the first and second rows of groups of external electrodes, and are each connected to one of the external electrodes in either the first or second row of group of external electrodes by means of the rewiring.
A semiconductor device comprising:
- a semiconductor substrate having an integrated circuit formed thereon;
- a plurality of electrode pads formed on the semiconductor substrate, being intended for input and output of signals between the integrated circuit and an external circuit;
- and
- a plurality of external electrodes connected to the plurality of electrode pads via rewiring, the external electrodes making connection terminals for the external circuit,
- wherein the plurality of external electrodes include a first row of group of external electrodes arranged linearly, and a second row of group of external electrodes arranged linearly in parallel with the first row of group of external electrodes, and
- wherein the plurality of electrode pads include a first row of group of electrode pads arranged linearly, and a second row of group of electrode pads arranged linearly in parallel with the first row of group of electrode pads, and
- wherein each of the electrode pads in the first and second row of group of the electrode pads are respectively connected to one of the external electrodes in the first and second row of group of external electrodes by means of the rewiring.
Dependencies are inferred from the claim text.