Apparatus for singulating and bonding semiconductor chips, and method for the same
AssigneeInfineon Technologies AG
InventorRudolf Lehner
Life of this patent
Estimating the term…
Abstract
An apparatus for singulating and bonding semiconductor chips includes a singulating station and a mounting station. In the singulating station, a semiconductor chip is provided with a bonding wire by a bonding tool and lifted off a carrier film. Then, in the mounting station, the semiconductor chip is placed on a chip mounting surface and fixed in place. The bonding wire is guided to a contact-connection surface of the circuit carrier and bonded to this surface.
Claims20
An apparatus for singulating and bonding semiconductor chips, comprising:
- a singulating station for semiconductor chips of a semiconductor wafer, the singulating station including a bonding tool for attaching a bonding wire on a semiconductor chip and a lift-off device for lifting a semiconductor chip off a carrier film covered with semiconductor chips of a semiconductor wafer, the bonding tool and the lift-off device are alignable opposite one another toward a semiconductor chip position of a singulating table for a semiconductor wafer divided into semiconductor chips, the singulating table is arranged between bonding tool and a raising device of the lift-off device;
- a mounting station, the mounting station including a circuit carrier, the circuit carrier includes a chip mounting surface for receiving a semiconductor chip bonded to a bonding wire of the bonding tool and at least one contact-connection surface for the bonding wire of the bonding tool to be bonded onto the contact-connection surface;
- and
- a raising and conveying mechanism with control apparatus for controlling and executing movements of the bonding tool, the singulating table, the lift-off device, and the circuit carrier.
A method for singulating and bonding semiconductor chips of a semiconductor wafer divided into semiconductor chips, the method:
- positioning a semiconductor wafer disposed on a carrier film and divided into semiconductor chips on a singulating table of a singulating station;
- aligning a bonding tool with bonding wire above one of the semiconductor chips on the singulating table;
- forming a bonding bead at an end of the bonding wire;
- lowering the bonding tool onto the semiconductor chip to bond the bonding bead onto a contact surface of the semiconductor chip;
- lifting the bonding tool with semiconductor chip suspended from the bonding wire off the carrier film;
- conveying the semiconductor chip on the bonding wire of the bonding tool to a mounting station, the mounting station including a circuit carrier with a chip mounting surface and at least one contact-connection surface;
- attaching the semiconductor chip on the chip mounting surface by the bonding tool;
- guiding the bonding wire by the bonding tool from the chip mounting surface to the contact-connection surface;
- and
- bonding the bonding wire on the contact-connection surface.
Dependencies are inferred from the claim text.