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US 2006/0065963 A1Published application
Electronic device
AssigneeIntel Corporation
InventorsAi Low, Dejen Eshete
Life of this patent
Estimating the term…
Abstract
An electronic device includes a first die that includes wires for bonding, a second die that includes an array of balls for bonding, and a substrate. The substrate includes bond sites for wires from the first die, and bond sites for the array of balls from the second die. The wires of first die are coupled to the bond sites for wires of the substrate. The balls of the second die are coupled to the bond sites for the array of balls of the substrate.
Claims30
1-13. (canceled)
An electronic device comprising:
- a first die that includes wires for bonding;
- a second die that includes an array of balls for bonding;
- a substrate comprising:
- wire bond sites for wires from the first die;
- and
- ball bond sites for the array of balls from the second die, the wires of first die coupled to the wire bond sites, and the array of balls of the second die coupled to the ball bond sites of the substrate.
3 more elements
An electronic system comprising:
- a circuit board;
- and
- an electronic device coupled to the circuit board, the electronic device comprising:
- a first die that includes wires for bonding;
- a second die that includes an array of balls for bonding;
- and
- a substrate comprising:
- wire bond sites for wires from the first die;
- and
- ball bond sites for the array of balls from the second die, the wires of first die coupled to the wire bond sites, and the array of balls of the second die coupled to the ball bond sites of the substrate, wherein the first die includes includes a FLASH memory.
7 more elements
Dependencies are inferred from the claim text.