Inductor energy loss reduction techniques

An inductive device, comprising:

• an inductor coil located over a substrate;
• at least one electrically insulating layer interposing the inductor coil and the substrate;
• and
• a plurality of current interrupters each extending into the substrate, wherein a first aggregate outer boundary of the plurality of current interrupters substantially encompasses a second aggregate outer boundary of the inductor coil.

A method of manufacturing an inductor device, comprising:

• forming a plurality of trenches in a substrate;
• filling at least partially each of the plurality of trenches;
• forming at least one insulating layer over the substrate, including over the plurality of trenches;
• and
• forming an inductor coil over the insulating layer, the inductor coil having a first aggregate outer boundary substantially encompassed by a second aggregate outer boundary of the plurality of trenches.

An integrated circuit device, comprising:

• a plurality of microelectronic devices each located at least partially in a substrate;
• a plurality of current interrupters each extending into the substrate, the plurality of current interrupters having a first aggregate outer boundary exclusive of ones of the plurality of microelectronic devices;
• and
• an interconnect structure located over the plurality of microelectronic devices and the plurality of current interrupters and including:
• interconnects interconnecting ones of the plurality of microelectronic devices;
• and
• an inductor coil having a second aggregate outer boundary substantially encompassed by the first aggregate outer boundary of the plurality of current interrupters.